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CAM MASTER 3D : EMBEDDED VISION REFERENCE DESIGN BOARD

A powerful platform ready-to-customize for robotic applications

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OVERVIEW

  • Modular reference design
  • Nexvision’s most powerful computer vision unit for robotic market
  • 2x NVIDIA® Jetson™ TX2 Module + FPGA video processing
  • On-board video analytics (object tracking, deep learning)

HIGHLIGHTS

  • On-board dedicated video enhancement image pipe
    (HDR, FPN, 3D noise reduction, HOG, stabilization), Nexvision’s IP : NEXIP™
  • Video : 3G-SDI in/out, HDMI output + optical fiber link
    (Quad Tx/Rx: up to 56 GT/s max, full duplex)
  • Gigabit Ethernet, USB 3.1 Gen 1, SATA 2, SPI, I2C, PCIe Gen 2
  • Onboard video recording and meta data storage (SSD on M.2)
  • Onboard streaming server based on our NexStream™

CAM MASTER 3D ECOSYSTEM

EMBEDDED SITUATIONAL AWARENESS PORTFOLIO

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A READY-TO-CUSTOMIZE PLATFORM
WITH HIGH-END SOFTWARE LIBRARY

IMAGE PROCESSING : NEXIP™

FPGA (Image Pre-Processing)

  • Video enhancement and advanced video processing : temporal noise filtering and contrast enhancement
  • Multiple exposure blending provides realtime HDR for high details retention in low and over exposed area
  • Multispectral band image sensor fusion (Visible, SWIR, Thermal IR)
  • Feature point extraction, image stabilization, denoising

GPU (Image analysis and codec)

  • Detection, recognition, tracking
  • Machine learning / AI
  • 3D perception / SLAM / 360° vision
  • Full framerate, high quality video encoding

SOFTWARE DEVELOPMENT

Dedicated embedded Linux BSP based on buildroot, including:

  • U-boot bootloader
  • Custom Linux kernel based on NVIDIA® sources
  • Integration of NVIDIA® Jetson™ specific frameworks: CUDA®, OpenCV, OpenGL TensorRT™, cuDNN, NVIDIA DIGITS™ Workflow, NVIDIA VisionWorks™, Camera Imaging, Video CODEC
  • Customizable failsafe update system (FPGA, Software)
  • Embedded debugging and profiling tools: quadd, nvprof, cuda-gdb, gdb, LTTng

External debugging and profiling tools:

  • Tegra system profiler, NVIDIA® NSight

Specific drivers:

  • FPGA: PCIe based, video acquisition, video display, Xilinx IPs
    (UART, SPI, I2C, XADC, …), high speed inter SoCs communication channel, generic data transfer to/from SoC modules

Nexvision’s Middleware:

  • Video analysis framework
  • Embedded video recording: H264, H265, MP4, MKV, AAC
  • Video streaming: RTSP/RTCP/RTP, H264, H265, AAC
  • ONVIF NVT profile support

SYSTEM SPECIFICATIONS

MAIN BOARD (PRE PROCESSING + I/O)

Front-end image processor (FPGA)
Xilinx Kintex Ultrascale (KU025 / 035 / 040 / 060 / 095) or Ultrascale + (KU11P or KU15P)

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One memory configuration

  • 512 Mb NOR flash
  • R/W access via SoC (over-the-air update via Ethernet)

Memory banks on FPGA

  • Up to 2x 512MB 16-bit DDR4@2400Mb/s (6.4 GB/s)
  • Up to 2x 1 GB 32-bit DDR4@2400 Mb/s (19.2 GB/s)

Development tools

  • 8-bit dedicated I/O (DSIO) LVCMOS 3.30V to FPGA
  • 1x JTAG port for FPGA configuration
  • 2x LED for FPGA

Environment management

  • 4x temperature sensors
  • 1x FAN drive by PWM 12V
  • Inertial sensors (3D acceleratometer, 3D gyroscope, 3D magnetometer)

EEPROM storage

  • 1x I2C 128 kb EEPROM

PROCESSING BOARD

1) Daughter board with two parallel NVIDIA® Jetson™ TX2 Modules

2x SoC modules

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Display
1x HDMI (Type A connector): HDMI 2.0 (4096×2160 at 60 Hz)

Ethernet
Up to 2x Gigabit slot RJ45 (limited to 1 per SoC) : 10/100/1000 BASE-T

Audio
Audio jack 3.5mm TRRS : analog stereo output + microphone

Wireless links
Embedded Bluetooth 4.0 / Wifi (802.11 a/b/g/n/ac)
4G/LTE modules or GPS via micro USB port

Serial
Up to 2x UART (Limited to 1 per SoC)

  • 1.80 V signalling
  • Embedded flow control

EEPROM storage
1 xI2C 128 kb EEPROM per SoC

Storage
Up to 2x SSD up to 2 TB (M.2 slot key B connector) (limited to 1 per SoC)

  • Single/double sided SSD compatible (2260/2280 format)
  • SATA 2 (3 Gb/s)

Up to 2x external SD card slot (limited to 1 per SoC)

  • Protocol SDIO 4.0 (UHS-I only) => Up to 104 MB/s
  • Backward compatible with all SD standard (Default Speed/High Speed/ SDR12/SDR25/DDR50/SDR50/SDR104)

USB
Up to 2x USB downstream (limited to 1 per SoC)

  • USB 3.1 Gen 1 (5 Gb/s)
  • Type-C type connector + power delivery 15 W

Up to 2x USB (limited to 1 per SoC)

  • USB 2.0 (480 Mbps)
  • Micro AB type connector
  • On-The-Go (OTG)
  • Power usage (2.5 W)

2) Daughter board with one NVIDIA® Jetson™ TX2 Module

Refer to above with only one Jetson™ TX2 Module and one instance of each interface

3) Daughter board: edge board connector

Configure as a root complex

  • Subject to be a master on a backplane
  • Compatible with NexVision’s switch 4x PCUO (up to 4x Gen3 4-lanes) (Host/Target/Non transparent port)

Configure as a legacy endpoint

  • Subject to be a slave on a PC (or a Server)

MAIN APPLICATION PURPOSE

Fiber Link
MTP optical standard:

  • 14 GT/s per lane [0 ; 70 ] °C
  • 10.3 GT/s per lane [-40 ; +85] °C

Proprietary fiber optic protocol up to 54 Gbps practical data throughput (64B/66B)
Example application :

  • Long distance camera head unit with SerDes (Embedded FPGA)
  • Video processing cluster

PCIe Link
Gen3 x4 (or x8 via 2x Firefly)
Backward compatible Gen2 and Gen1
Physical interface

  • Fiber optic direct link (1x MTP optical standard)
  • Copper direct link
  • Edge slot standard via mezzanine
    > Compatible with NexVision’s switch 4x PCUO (Up to 4x Gen3 4-lanes) (Host/Target/Non transparent port)
  • SSD Connector (M.2 / NGFF) or (U.2 / SFF-8639) via mezzanine
    > NVMe SSD solution

Copper Link
Firefly

  • 16.6 GT/s per lane

Proprietary protocol up to 64 Gbps practical data throughtput (64B/66B)
Example application :

  • Very short distance camera head unit with SerDes (Embedded FPGA)
  • Video processing cluster

Digital Video Interface via mezzanine
Up to 4x Input/ Output per Firefly
6G-SDI or Coaxpress :

  • SMPTE ST-2081
  • Example video format:>2160p30 10-bit 4:2:0
  • Backward compatible with SMPTE 424M and SMPTE 292M

Dual link and quad link 6G-SDI option

  • Example video format:> 4320p30 10-bit 4:2:0> 2160p120 10-bit 4:2:0> 2160p60 12-bit 4:4:4

Up to 2x independant user purpose interface

Board-to-Board interface or flex cable
Provide main 3.60V supply voltage and low power 3.30V voltage
Level voltage signalling referenced by the targeted board, support :

  • Up to 24 LVDS pairs
  • Up to 52 LVCMOS flexible (1.20-1.80 V)
  • Up to 18 LVMCOS fixed 3.30V

Application examples
Short distance image sensor board:

  • High resolution color or monochrome sensors
  • High framerate sensors
  • Night vision sensor
  • 3D perception / ToF sensors
  • Thermal infrared sensor (LWIR/MWIR)

General purpose input/output:

  • HMI (Human Machine Interface) – User buttons
  • Pressure sensor and temperature sensor
  • Isolated I/O
  • Serial low speed links (UART, RS232, RS485, CAN)

Analog video and time code:

  • Composite analog video PAL/NTSC (I/O)
  • GenLock via CVBS (I/O)
  • Linear time code (LTC I/O)

Power supply options

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MECHANICAL

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Environment

Standard
Operating temperature : Commercial 0 to +50°C
Humidity resistance : 10-90% non-condensing

Optional
Operating temperature : Extended -20°C to 80°C
Humidity resistance : Tropicalized

Feel free to contact us for any question !